### Term: August – December 2016

##### E1-247 2:1 - Incremental Motion Control System - N.S. Dinesh (NSD)

Introduction to various incremental motion systems, Principles of operation and classification of various types of stepper motors, control and drive circuits. Improved control and drive techniques in open and closed loop. Use of DC motors in incremental motion systems and related control techniques.

**N S Dinesh**

Kuo, B.C., Step Motors and Control Systems, SRL Publishing Co., Illinois, 1979

Proceedings of Annual Symposium on Incremental Motion Control Systems and Devices, from 1974 onwards published by IMCSS Champain

##### E1-261 3:0 - Selected Topics in Markov Chains and Optimization - Joy Kuri (JK)/ Shayan S G (SSG)

**E1 261 (AUG) 3:0**

**Selected Topics in Markov Chains and Optimization**

Finite state Markov Chains: Rate of convergence to steady state, Eigenstructure of the transition matrix, Perron-Frobenius Theorem, Reversible transition matrices, bounds on convergence rates; Markov Chain Monte Carlo: Knapsack problem—Target distribution sampler, Gibbs sampling, Metropolis-Hastings algorithm, Simulated Annealing, Examples from Bayesian networks and inference problems; Topics in Graph Theory: Matchings and Factors with applications, Connectivity and Paths; Enumeration combinatorics: Generating functions, Sieve methods, Posets; Semidefinite Programming: Quadratically Constrained Quadratic Programming (QCQP), Maximum Eigenvalue and Matrix Norm minimization, Applications to combinatorial problems

**Joy Kuri, Shayan G. Srinivasa**

Norris J.R., Markov Chains, Cambridge University Press, ISBN-10: 0521633966.

Hajek Bruce, An Exploration of Random Processes for Engineers (course notes for EC-534, “Random Processes”), http://www.ifp.illinois.edu/~hajek/

Bremaud Pierre, Markov Chains: Gibbs Fields, Monte Carlo Simulation and Queues,” Springer, 1999

West Douglas, Introduction to Graph Theory, Pearson 2nd ed., ISBN-10: 0130144002.

Vandenberghe L. and Boyd S., Semidefinite Programming, in SIAM Review, March ’96

##### E2-230 3:0 - Network Science and Modeling - Chandramani Singh (CS)

**E2 230 (AUG) 3:0 **

**Network Science and Modeling**

Introduction to main mathematical models used to describe large networks and dynamical processes that evolve on networks. Static models of random graphs, preferential attachment, and other graph evolution models, Epidemic propagation, opinion dynamics, and social learning, Applications drawn from physical, informational, biological, cognitive, and social systems as well as networked decision systems such as Internet

**Chandramani Singh**

- Newman. Networks: An Introduction. Oxford University Press, 2010
- Easley and J. Kleinberg, Networks, Crowds and Markets

##### E2-232 2:2 - TCP/IP Networking - T.V.Prabhakar (TVP)/Haresh Dagale (HD)/Joy Kuri (JK)

**E2 232 (AUG) 2:2**

**TCP/IP Networking**

IP addressing, IP header; subnetting and supernetting, CIDR, routing table, Ethernet, ARP; Serial links, PPP, ICMP, UDP, TCP: header, connection establishment, ISN, half close, delayed acks, header flags, TCP state transitions, sliding window, Slow Start, Congestion Avoidance, Fast Retransmit, Fast Recovery; DNS; multicasting, IGMP; IEEE 802.11 wireless LANs; Bridges, L2 switches, Spanning Tree algorithm, VLANs; Mobile IP; Private IP; NAT; DHCP; http; routing protocols: RIP, OSPF, BGP; IPv6

Lab: Scripting, network tools; Wireshark, tcpdump, netperf, hping2, network programming, TCP/IP networking in Linux

**T.V.Prabhakar, Haresh Dagale, Joy Kuri**

Richard Stevens, TCP/IP Illustrated, vol I: The Protocols, Pearson Education Asia, 2000

Douglas Comer, Internetworking with TCP/IP vol I: Principles, Protocols and Architecture, Prentice Hall, 4th Edition, 2000

Selected Internet RFCs (Request for Comments), available at http://www.ietf.org/rfc.html

##### E2-243 2:1 - Mathematics for Electrical Engineers - R. Vittal Rao (RVR)

**E2 243 (AUG) 2:1**

**Mathematics for Electrical Engineers**

Fourier series and Fourier transform LTI system, signals, sampling and sampling theorem, discrete and continuous signals, DFT.

Linear algebra: linear system of equations range and null space, singular value decomposition of a matrix, pseudo-inverse of a matrix, optimal solution of a system.

Probability: random experiments, sample space, events, sigma algebra, probability measure random variables, probability distribution function, discrete and continuous distributions, joint distributions, distribution of functions of random variables, some random processes.

** Vittal Rao**

Bracewell R., Fourier Transform and its applications, (3^{rd} edition) McGraw Hill, 2000

Strang G., Linear Algebra and its applications, (4^{th} edition) Thomson, 2006

Leon-Garcia A., Probability, statistics and Random Processes for Electrical Engineers, Pearson Prentice Hall, 2008.

##### E3-225 3:0 - Art of Compact Modeling - Santanu Mahapatra (SM)

**E3 225 (AUG) 3:0**

**Art of Compact Modeling**

Band theory of solids, carrier transport mechanism, P-N junction diode, MOS Capacitor Theory, C-V characteristics, MOSFET operation, Types of compact models, Input Voltage Equation, Charge Linearization, Charge Modeling, Concept of Core Model, Quasi-static and Non-quasi-static Model, Introduction to Verilog-A, Basic theory of circuit simulation, Brief overview of EKV and PSP

**Santanu Mahapatra **

Tsividis, Y., Operation and Modelling of the MOS Transistor, Oxford University Press, 2012

Arora, N., MOSFET modeling for VLSI simulation: Theory and Practice, World Scientific Publishing Company, 2007

Foty, D., MOSFET modeling with SPICE, Prentice Hall, 1997

Liu, W., MOSFET Models for SPICE Simulation, Wiley-IEEE Press, 2001

Enz C and Vittoz E, Charge-based MOS transistor modeling, Wiley, 2006

Gildenblat, G., Compact Modeling: Principles, Techniques and Applications, Springer, 2010

##### E3-230 2:1 - Essential Circuits for System Design - L. Umanand(LU)/NSD/Haresh Dagale (HD)

**E3 230 (AUG) 2:1**

**Essential Circuits for System Design**

Analog Signal conditioning circuits: Buffering, scaling, level translation, filtering and applications

Analog math circuits – arithmetic circuits, log circuits, trigonometric circuits and applications

Timer circuits, pulse width modulation circuits, P, PI and PID controller circuits, protection circuits, base and gate drive circuits for power transistors, MOSFETs and IGBTs, relay and contactor drive circuits.

Power supply circuits: Board level power supply circuits to generate +/-12V, 5V, 3.3V, 1.8V. Linear regulators, low drop out regulators, charge pumps, switched mode power converters.

Interfacing circuits: A to D, D to A, A to A and D to D interfaces, serial and parallel DACs, sampling, RS-232, USB, I2C, LCD, serial memory, SPI, wireless, Ethernet, RFID, SD card, SIM card, GPS interfaces

Digital circuit essentials: Digital filters, moving average, numeric formats, scaling, normalizing, arithmetic, log, exponential, square root, cube root, hypotenuse, sine, 3 phase waves, PWM etc.

Laboratory: 6 sessions for Analog signal conditioning circuits, 4 sessions for power supply circuits and 8 sessions for interfacing circuits. For interfacing circuits, an 8-bit microcontroller with DIP package (probably in ATmega series) can be used so that students can rig up the circuits during lab sessions on general purpose boards.

**L Umanand, N S Dinesh, Haresh Dagale**

Data sheets, Application Notes

##### E3-262 2:1 - Electronic Systems Packaging - G.V. Mahesh (GVM)

**E3 262 (AUG) 2:1**

**Electronic Systems Packaging**

Electronic systems and needs, physical integration of circuits, packages, boards and complete electronic systems; system applications like computer, automobile, medical and consumer electronics with case studies and packaging levels. Electrical design considerations – power distribution, signal integrity, RF package design and Power-delivery in systems. CAD for Printed Wiring Boards (PWBs) and Design for Manufacturability (DFM). PWB Technologies, Single-chip (SCM) and Multi-chip modules (MCM), flex circuits. Recent trends in manufacturing like microvias, sequential build-up circuits and high-density interconnect structures. Materials and processes in electronics packaging, joining methods in electronics; lead-free solders. Surface Mount Technology – design, fabrication and assembly, embedded passive components; thermal management of PWBs, thermo-mechanical reliability, design for reliability, electrical test and green packaging issues, Assignments in PCB CAD; Hands-on lab sessions for board manufacturing and assembly.

**G V Mahesh**

Rao R. Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, NY, 2001.

Rao R Tummala & Madhavan Swaminathan, Introduction to System-on-Package, McGraw Hill, 2008.

R S Khandpur, Printed Circuit Boards, McGraw Hill, 2006.

Class Notes and other references provided during the course.

##### E3-274 3:0 - Power Semiconductor Devices and Physics - Mayank Srivastava (MS)

**E3-274 (AUG) 3:0**

**Power Semiconductor Devices and Physics**

Power device applications: Power electronic applications, High voltage and high power circuits, RF power circuits and applications, On-chip circuits and power management system, high switching speed requirements for power system scaling.

Semiconductor Physics under extreme conditions: Basics of semiconductor device physics, p-n junction, carrier transport under extreme conditions, avalanche breakdown, and thermal transport.

Power Diodes: Various types of power diodes: Si diodes, Schottky diodes and P-i-N diodes; Physics of power diodes, power diode design essentials, breakdown voltage and ON-resistance trade-off, high current and ultra fast transient behavior.

Si High Power MOS devices, design and Technology: VMOS, VDMOS, UMOS, DMOS, LDMOS, DeMOS and Dual trench MOS; Process flow, discrete and On-chip device manufacturing technology; High power MOS design essentials, breakdown voltage and on-resistance trade-off, parasitic capacitance and resistances, DC, RF and switching characteristics; quasi saturation behavior, high current effects, Negative differential resistance (NDR), self heating, filament formation and safe operating area (SOA).

GaN and SiC Power MOS devices: Advantage of high bandgap materials, High bandgap material physics, various GaN/SiC devices, device physics and design essentials, GaN/SiC device manufacturing technology; breakdown voltage and on-resistance trade-off, parasitic capacitance and resistances, DC, RF and switching characteristics; quasi saturation behavior, self heating effects and safe operating area (SOA); state-of-the-art GaN/SiC devices and ongoing research.

IGBTs and SCR: IGBTs and SCR device physics and device design essentials, breakdown voltage and on-resistance trade-off, self heating effects and filament formation.

**Mayank Shrivastava**

**Prerequisites**: Basic Semiconductor Physics

Semiconductor power devices: Physics of operation and fabrication technology**, **Sorab Khushro Ghandhi, Wiley, 1977

Advanced Power MOSFET Concepts**, **B. Jayant Baliga, 2010

High Voltage Devices and Circuits in Standard CMOS Technologies**, **Hussein Ballan, Michel Declercq

Fundamentals of Power Semiconductor Devices, B. Jayant Baliga, 2010

Smart Power ICs: Technologies and Applications**,** edited by Bruno Murari, Franco Bertotti, Guiovanni A. Vignola

Silicon Carbide Power Devices**, **B. Jayant Baliga, World Scientific, 2005

Integrated Power Devices and TCAD Simulation**, **Yue Fu, Zhanming Li, Wai Tung Ng, Johnny K.O. Sin

Advanced High Voltage Power Device Concepts, B. Jayant Baliga, 2011

##### E6-202 2:1 - Design of Power Converters - L. Umanand (LU

**E6 202 (AUG) 2:1**

**Design of Power Converters**

Power semiconductor switches, drive circuits for MOSFETs and IGBTs, snubber circuits, rectifier circuits, dc-dc switched mode converter circuits, pulse width modulation, non-isolated and isolated converters, magnetics for switched mode power conversion, design of magnetics, magnetic amplifiers, inverter circuits-self oscillating and driven inverter circuits, efficiency and losses in power electronic circuits, thermal issues and heat sink calculation.

**L Umanand**

Mohan, Undeland and Robbins, Power Electronics: Converters, Applications and Design, John Wiley and Sons, 1989.

Chryssis, G.C., High frequency switching power supplies, McGraw Hill 2nd Edition, 1989

Umanand, L., Power Electronics: Essentials and Applications, chapters 1 to 7, John Wiley, India, 2009.

##### E9-252 3:0 - Mathematical Methods & Techniques in Signal Proc - Shayan Srinivasa Garani (SSG)

**E9 252 (AUG) 3:0**

**Mathematical methods and techniques in signal processing**

Review of basic signals, systems and signal space: Review of 1-D signals and systems, review of random signals, multi-dimensional signals, review of vector spaces, inner product spaces, orthogonal projections and related concepts. Basics of multi-rate signal processing: sampling, decimation and interpolation, sampling rate conversion (integer and rational sampling rates), oversampled processing (A/D and D/A conversion), and introduction to filter banks. Signal representation: Transform theory and methods (FFT and variations, KLT), other transform methods. Statistical signal modeling: The least squares method, Pade’s approximation, Prony’s method, Shanks’ method, iterative pre-filtering, all-pole modeling and linear prediction, autocorrelation and covariance methods, FIR least squares inverse filter design, applications and examples. Inverse problems (signal reconstruction): underdetermined least squares, pseudo-inverse (SVD), min-norm solutions, regularized methods, reconstruction from projections, iterative methods such as projection onto convex sets, expectation-maximization and simulated annealing.

**Shayan Srinivasa Garani**

** **

Moon & Stirling, Mathematical Methods and Algorithms for Signal Processing, Prentice Hall, 2000 (required)

Monson Hayes, Statistical Digital Signal Processing and Modeling, John Wiley and Sons, 1996 (optional)

Class notes

### Term: January – April 2017

##### E1 243 (JAN) 2:1 - Digital Controller Design - Umanand

**E1 243 (JAN) 2:1**

**Digital Controller Design**

Modeling of Systems: input/output relations, linearization, transfer function and state space representations, circuit averaging, bond graph and space vector modeling; Control system essentials- representation in digital domain, z-transform, digital filters, s-z mapping, sampling issues, continuous to discrete domain conversions; Controller design-Bode method, root locus method, PID controller, State space methods, full state feedback, pole placement, estimator design, prediction, current and reduced order estimators, introduction to optimal and robust controller design.

** Umanand**

Franklin, G.F., Powell, J.D., Workman, M.L., Digital Control of Dynamic Systems, 2nd Ed., Addison-Wesley, MA, USA, 1990.

Friedland, B., Control System Design-An Introduction to State Space Methods, McGraw Hill, 1987

Lewis, F.L., Applied Optimal Control and Estimation, Prentice Hall, USA, 1992.

Umanand, L., Power Electronics: Essentials and Applications, Chapters 8 to 11, John Wiley, India, 2009.

##### E2-222 (JAN) 3:0 - Communication Networks Analysis - Chandramani Singh

**E2-222 (JAN) 3:0**

**Communication Networks Analysis**

Introduction to the layered network architecture; Adaptive window flow control and TCP protocols; Scheduling in packet networks, max-weight scheduling, complexity, and distributed randomized algorithms; Routing protocols; MAC layer protocols in wireless networks; Scheduling in wireless networks; Throughput scaling laws for wireless networks; Network resource allocation, Interpretation of network architecture and algorithms in terms of optimization solution; Game-theoretic interpretation of optimization formulation and solution; A brief introduction to Peer-to-peer networks and Cloud networking.

**Chandramani Singh**

Srikant and L. Ying, Communication Networks: An Optimization, Control and Stochastic Networks Perspective, Cambridge University Press, 2014

Anurag Kumar, D. Manjunath, Joy Kuri, “Communication Networking: An Analytical Approach,” Morgan Kaufman Series in Networking, May 2004

##### E3 231 (JAN) 2:1 - Digital Systems Design with FPGAs - Kuruvilla Varghese

**E3 231 (JAN) 2:1**

**Digital Systems Design with FPGAs**

Introduction to Digital design; Hierarchical design, controller (FSM), case study, FSM issues, timing issues, pipelining, resource sharing, metastability, synchronization, MTBF Analysis, setup/hold time of various types of flip-flops, synchronization between multiple clock domains, reset recovery, proper resets. VHDL: different models, simulation cycles, process, concurrent and sequential statements, loops, delay models, library, packages, functions, procedures, coding for synthesis, test bench. FPGA: logic block and routing architecture, design methodology, special resources, Virtex-II, Stratix architectures, programming FPGA, constraints, STA, timing closure, case study.

**Kuruvilla Varghese**

Wakerly, J. F., Digital Design: Principles and Practices 4th Edition, Pearson, 2008

Skahil, K., VHDL for Programmable Logic 1st Edition, Pearson, 2004

FPGA Data sheets, Application Notes

Current literature from relevant journals and conference proceedings

##### E3-257 (JAN) 2:1 - Embedded Systems – I - Haresh Dagale

**E3-257 (JAN) 2:1**

**Embedded Systems – I **

Introduction to embedded software development, S/W Development environment- Cross compiler, Linker, Debugger, Stand-alone systems; Introduction to embedded computing, Introduction to RISC architecture, Introduction to ARM Cortex architecture and ARM/THUMB instruction set, Clocks and Power Management, Low power design, Memories, application development, Peripherals.

**Haresh Dagale**

** **Alred Aho, Monica Lam, Ravi Sethi and Jeffery Ullman, Compliers Principles, Techniques and Tools, Pearson Education

John Levine, Linkers & Loaders, Morgan Kaufmann

ARM System Developer’s Guide

Andrew N Sloss, Dominic Symes and Chris Wright, Designing and Optimizing System Software, Elsevier

Joseph Yiu, The Definitive Guide to the ARM® Cortex-M3, Newnes Publications

David A Patterson and John Hennessy, Computer Organization and Design, Morgan Kaufmann

##### E3-258 (JAN) 2:1 - Design for Internet of Things - H S Jamadagni, T V Prabhakar

**E3-258 (JAN) 2:1**

**Design for Internet of Things**

Embedded Systems: Rise of embedded systems and their transition to intelligent systems and to Internet of Things – RFIDs, NFC, Web of Things – Network of interconnected and collaborating objects, Embedded systems architecture: Key hardware and software elements, typical embedded processors like ATOM. Low power and very low power embedded systems, peripherals and sensors in embedded systems, peripheral interfacing – SPI and I2C, Hardware and software protocol stacks – MAC, Routing and application layers, performance considerations. Embedded Systems Design: Partitioning to hardware and software; principles of co-design; performance of these systems – estimation of speed, throughput, power and energy consumption; hardware design elements – design, validation, and testing tools; software platforms – OS and applications, code optimization, validation and robust code generation; system integration, debugging and test methodology; tools for coding, debugging, optimization, and documentation; measurement of system performance, Linux distributions for embedded systems using tools from Yocto project; Creating virtual prototypes – hardware software emulation. Applications: Healthcare and home automation examples.

**H S Jamadagni, T V Prabhakar**

Barry, P., and Crowley, P., Modern Embedded Computing, Morgan Kaufmann, 2012

Wolf, M., Computers as components Third edition, Morgan Kaufmann, 2012

Other online references to be provided during the course

##### E3-271 (JAN) 3:0 - Reliability of Nanoscale Circuits and Systems - Mayank Shrivastava

**E3-271 (JAN) 3:0**

**Reliability of Nanoscale Circuits and Systems **

Carrier transport and carrier energy fundamentals, avalanche multiplication and breakdown, hot carrier induced (HCI) degradation mechanism, NBTI/PBTI, TDDB, GOI and Electromigration, ESD and latch-up phenomena, Test models and methods, ESD protection devices and device physics, Advance ESD protection devices, high current effects and filaments, Negative differential resistance, Physics of ESD failure, ESD protection methodology, ESD protection circuits, ESD protection for Analog/RF and mixed signal modules, General rules for ESD design, layout considerations for ESD and latch-up protection, understanding parasitics, ESD circuit simulation basics and requirements, ESD TCAD simulation methodology, System on Chip overview and system ESD aspects, case studies related to product failures and solutions used

**Mayank Shrivastava**

Review Papers on NBTI/PBTI, HCI Degradation, TDDB, Electromigration

ESD in Silicon Integrated Circuits by Ajith Amerasekera and Charvaka Duvvury, Wiley publication

Basic ESD and I/O Design by Sanjay Dabral and Timothy J. Maloney, Wiley publication

Advanced Simulation Methods for ESD protection development by Kai Esmark, Harald Gossner and Wolfgang Stadler, Elsevier Publication

ESD Physics and Devices by Steven H. Voldman, Wiley publication

** **

**Prerequisites: **

Solid State device Physics

Basics of MOS and Bipolar junction transistors

##### E3-272 (JAN) 3:0 - Advanced ESD devices, circuits and design methods - Mayank Shrivastava

**E3-272 (JAN) 3:0**

**Advanced ESD devices, circuits and design methods**

History of key inventions in the field of ESD and latch-up protection, Review on various ESD testers and ESD test models, problems associated with ESD testers and progress on ESD tester development. High current injection, High field effects, Negative differential resistance and Current filaments, Drain extended MOS devices and associated week ESD robustness. ESD behavior of FinFET devices, SiGe-FETs and other quantum well devices, Impact of stress & strain on ESD behavior, ESD devices in advanced CMOS and BiCMOS technology, Impact of technology scaling on ESD behavior, Special analog and RF ESD protection devices and circuits. Impact of ESD stress on CNTs, Graphene and other 2D material based Nanoelectronic devices. ESD Device modeling for circuit simulations, State-of-the-art on CDM ESD protection, CDM tester models, modeling CDM behavior and CDM simulations, ESD verification flow and methodology, Towards full chip ESD simulation, Transient latch-up, System level ESD, System efficient ESD design (SEED), Case studies.

**Mayank Shrivastava**

**Pre-requisite: **ESD Devices and Circuit Design

ESD Protection Device and Design for Advanced CMOS Technologies by Oleg Semenov, Hossein Sarbishaei and Manoj Sachdev, Elsevier

ESD RF Technology and Circuits by Steven H. Voldman, Wiley

Nanoelectronics – Nanowires, Molecular Electronics and Nanodevices by Krzysztof Iniewski, McGraw Hill, 2011

Physical Limitations of Semiconductor Devices by Vladislav A. Vashchenko and V.F. Sinkevitch, Elsevier

Transient – Induced Latchup in CMOS Integrated Circuits by Ming-Dou Ker and Sheng-Fu Hsu, Wiley 2009

ESD Design for Analog Circuits by Vladislav A. Vashchenko and Andrei Shibkov, Elsevier

##### E6 212 (JAN) 3:0 - Design and Control of Power Converters and Drives - K Gopakumar

**E6 212 (JAN) 3:0**

**Design and Control of Power Converters and Drives**

Basics of phase controlled converters, Choppers, Front end Ac to DC converter, DC motor speed control, inverters, six step operation, sinusoidal PWM control, current hysteresis PWM and space vector PWM control of three phase inverters. Generation of the three phase PWM signals from sampled reference phase amplitudes and PWM control in overmodulation region, Speed control of induction motor; V/f operation, dynamic equivalent circuit model of induction motor and vector control of induction motor. Current source inverter, Multilevel inverters and its control.

**K Gopakumar**

Leonhard W., Control of Electrical Drives, Springer-Verlag, 1985

Mohan, Undeland and Robbins, Power Electronics: Converters, Application and Design, John Wiley and Sons, 1989

Krishnan, R., Electric Motor drives: Modelling, Analysis and Control, Prentice Hall, March 2001

Gopakumar K., Lecture notes

##### E6 222 (JAN) 2:1 - Design of Photovoltaic Systems - L Umanand

**E6 222 (JAN) 2:1**

**Design of Photovoltaic Systems**

Introduction to photovoltaic energy conversion, Solar radiation and measurement, Solar cell and their characterization, Influence of insolation and temperature, Maximum power point tracking, Electrical storage with Batteries, controllers, DC power conditioning, AC power conditioners for grid connection, Solar power drives, Applications for pumping/refrigeration, Economic analysis of PV system, Energy analysis of PV system.

**L Umanand**

Chenming, H. and White, R.M., Solar Cells from B to Advanced Systems, McGraw Hill Book Co, 198: Ruschenbach, HS, Solar Cell Array Design Hand Varmostrand, Reinhold, NY, 1980

Proceedings of IEEE Photovoltaics Specialists Conference, Solar Energy Journal

##### E9 251 (JAN) 3:0 - Signal Processing for Data Recording Channels - Shayan Srinivasa Garani

**E9 251 (JAN) 3:0**

**Signal Processing for Data Recording Channels**

Introduction: Review of basic principles behind the physics of magnetic recording, super paramagnetic limits, technological trends in magnetic storage/optical systems, recording schemes in magnetic and optical devices. Signal Modeling: Communication theoretic framework of read/write channels. Models for analog read back signal with inter-symbol interference, noise and distortion sources, notion of channel and user bit densities towards SNR definition. Signal Processing Methods: Equalization and timing recovery, PLLs, ML based timing recovery methods, Detection techniques based on the BCJR algorithm and its low complexity variations, turbo-equalization methods. Coding Techniques: Introduction to constrained modulation codes, review of algebraic and graphical coding techniques, interleaving mechanisms and analysis of the code performance. Implementation: Hardware related aspects for realizing signal processing algorithms on a system-on-chip (SoC).

**Shayan Srinivasa Garani**

Bergmans, J.W.M., Digital Baseband Transmission and Recording, Kluwer Academic Press, 1996

Vasic, B., and Kurtas, E., Coding and Signal Processing for Magnetic Recording Systems, CRC Press, 2004

##### E3 262 (AUG) 2:1 - Electronic Systems Packaging - G V Mahesh

### Addition / Deletion / Changes from previous year’s SoI

The following course content is changed

**E3 262 (AUG) 2:1**

**Electronic Systems Packaging**

Electronic systems and needs, physical integration of circuits, packages, boards and complete electronic systems; system applications like computer, automobile, medical and consumer electronics with case studies and packaging levels. Electrical design considerations – power distribution, signal integrity, RF package design and Power-delivery in systems. CAD for Printed Wiring Boards (PWBs) and Design for Manufacturability (DFM). PWB Technologies, Single-chip (SCM) and Multi-chip modules (MCM), flex circuits. Recent trends in manufacturing like microvias, sequential build-up circuits and high-density interconnect structures. Materials and processes in electronics packaging, joining methods in electronics; lead-free solders. Surface Mount Technology – design, fabrication and assembly, embedded passive components; thermal management of PWBs, thermo-mechanical reliability, design for reliability, electrical test and green packaging issues, Assignments in PCB CAD; Hands-on lab sessions for board manufacturing and assembly.

**G V Mahesh**

Rao R. Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, NY, 2001.

Rao R Tummala & Madhavan Swaminathan, Introduction to System-on-Package, McGraw Hill, 2008.

R S Khandpur, Printed Circuit Boards, McGraw Hill, 2006.

Class Notes and other references provided during the course.